Metal, sheet metal, frame, and resin material processors.
Precision metal processing: Strong surface treatment ability, capable of PTFE coating, electrolytic polishing, low-temperature black chromium plating, anodizing, etc., with the ability for clean cleaning and packaging;
Sheet metal processing: The bending accuracy can be achieved within ± 0.1mm, and it has the ability to groove, rivet, mirror stainless steel processing, SPCC spraying, etc;
Framework production: It has the ability of overall processing and assembly adaptation, PVC frame wrapping and leak proof welding ability, and welding and adaptation of all metal frames;
Resin materials: Processing requires a certain level of semiconductor experience, a dedicated constant temperature and humidity workshop, the ability to weld materials such as PEEK, PTFE, PFA, etc., and clean cleaning and packaging capabilities;
Module package supplier: capable of processing, assembling, and debugging the entire module, such as semiconductor wafer chuck, transfer unit, etc.